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Surface Mount Multilayer Varistors (MLVs) > AUML Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
Re?ow Solder Pro?le
The termination option available for each solder technique is:
230
The recommended solder for the AUML suppressor is
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
Figure 9
Wave Solder Pro?le
300
gradient steeper than 4 degrees per second; the ideal
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it
is still necessary to ensure that any further thermal
shocks are avoided. One possible cause of thermal
250
200
150
100
50
MAXIMUM WAVE 260 o C
SECOND PREHEAT
FIRST PREHEAT
shock is hot printed circuit boards being removed from
0
0.0
0.5
1.0
1.5
2.0 2.5 3.0
3.5
4.0
4.5
at room temperature. The boards must be allowed to
Lead–free (Pb-free) Soldering Recommendations
Figure 10
TIME (MINUTES)
Littelfuse offers the Nickel Barrier Termination ?nish for the
optimum Lead–free solder performance.
?ux, but there is a wide selection of pastes and ?uxes
available with which the Nickel Barrier parts should be
Lead–free Re-?ow Solder Pro?le
MAXIMUM TEMPERATURE 260?C
20 - 40 SECONDS WITHIN 5?C
compatible.
The re?ow pro?le must be constrained by the maximums
RAMP RATE
<3?C/s
60 - 150 SEC
> 217?C
PREHEAT ZONE
Note: the Lead–free paste, ?ux and pro?le were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
Figure 11
5.0
6.0
7.0
optimum combination for their process as processes vary
considerably from site to site.
?2010 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/AUML.html for current information.
Revision: September 14, 2010
AUML Varistor Series
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